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ERC for Environmentally Benign Semiconductor Manufacturing

Faster-Cleaner-Cheaper Semiconductor Manufacturing

Currently, in the manufacturing of semiconductor and nano devices, various materials are deposited in layers and then almost completely removed after patterning, in what is called "subtractive processing." Research at the ERC for Environmentally Benign Semiconductor Manufacturing (EBSM) has laid the groundwork for a more efficient "additive processing" approach that promises to improve performance and lessen the materials and energy use and waste in semiconductor manufacturing.

In conjunction with Stanford and UC Berkeley, ERC researchers at the University of Arizona's EBSM made a major breakthrough: They developed a new selective deposition process in which metals are added directly to the substrate to form the gates. Working with Cornell and the Massachusetts Institute of Technology (MIT), they also developed new photo-imageable materials. Together, these new approaches eliminate four steps in the chip manufacturing process that waste energy, materials, and water. As a result, the new process is also much more environmentally friendly and less expensive than the process it replaces.

The ERC's Industrial Advisory Board, consisting of 44 companies from six countries, recently reviewed this technology and pronounced it a major accomplishment. Five industrial advisory board members are assisting in the transfer of this technology. MIT Professor Karen Gleason and her former graduate students Hilton Pryce Lewis and Kenneth Lau, graduates of the EBSM, have founded startup firm GVD Corp. to commercializing the technology.

To learn more about this topic:
Visit the ERC for Environmentally Benign Semiconductor Manufacturing research page at http://www.erc.arizona.edu/Research/new%20research_index.htm.

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Diagram 320x180.  Click on the image above to see an illustration of the hybrid processing method.

Click on the image above to see an illustration of
the hybrid processing method.

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Last modified: July 21, 2006