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Center for Wireless Integrated MicroSystems (WIMS)
University-Industry Collaboration Yields Advances in Cochlear Implants for Deaf
Researchers at the Center for Wireless Integrated MicroSystems (WIMS), an NSF-funded Engineering Research Center (ERC), have been working with academic and private-sector partners over the past year to join thin-film electrode arrays with backing structures that permit their deep insertion into the scala tympani and position the electrodes close to auditory neurons along the length of the cochlea.  WIMS has developed an advanced 32-site cochlear implant with sites on 250µm centers as a prototype for a 128-site human array.  This is eight times the number of sites currently available in the marketplace.  However, backing the arrays to provide the stiffness and curl needed for deep insertion has represented a barrier to the development of thin-film arrays capable of restoring hearing to the deaf in the past.  This problem must be solved to successfully test thin-film electrode arrays and realistically assess the improvements in pitch perception made possible using them.

WIMS core partners the University of Michigan (UM), where the ERC is headquartered, Michigan State University, and Michigan Technological University (MTU) have been collaborating with the University of California at San Francisco, the University of California at Irvine, and Cochlear Corporation on attaching molded backing structures to the Center-developed parylene arrays to try to achieve this advance.

MTU researchers have attached articulated polyethylene therephthalate (PET) tubes to electrode arrays in the past, but this is the first time molded backing has been successfully applied to make the thin-film arrays similar to commercial wire bundles in terms of their insertion characteristics.  The UM is also working on backing structures, focusing on a monolithic process that would realize the needed compliance with just enough built-in stress to allow the array, at rest, to hug the modiolar wall of the cochlea.

The work done by the ERC in conjunction with other academic and private sector partners will eventually improve the cochlear implants by providing more stimulating sites to improve the quality of sound delivered through cochlear implants, so that the hearing impaired can hear pitch more realistically and enjoy music more fully. 

To learn more about this topic visit:
Center for Wireless Integrated MicroSystems (WIMS)

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The Center for Wireless Integrated MicroSystems (WIMS) has worked with the Cochlear Corporation to successfully join a molded backing to a 32-site parylene probe developed as part of WIMS’ efforts to improve the thin-film electrode arrays used in cochlear implants.
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